June 28, 2026, (Inside AI) — Advanced chip packaging, once a sleepy niche, now throttles the global AI race. The U.S. controls just 3% of this market, while Taiwan Semiconductor Manufacturing Co. (TSMC) handles 95% of all advanced packaging, creating a strategic choke point that even $50 billion in CHIPS Act subsidies hasn’t broken.
Subramanian Iyer, a 72-year-old UCLA professor and former IBM technologist, helped pioneer the interposer technology that makes modern AI chips possible. His planned $1.1 billion packaging R&D center in Arizona, funded by the Biden administration, was scrapped under Trump. “The bottom line is they’ve thrown the baby out with the bathwater,” Iyer said. “We’ve ended up in a place where we are even more dependent on TSMC.”
Packaging bundles dozens of chip components into palm-size modules, enabling the massive transistor counts AI demands. Without it, “you can’t make them,” said Mark Gardner, Intel’s packaging VP. Nvidia’s upcoming Rubin processor uses TSMC’s CoWoS (chip on wafer on substrate) to pack 336 billion transistors, but TSMC won’t offer CoWoS in Arizona until 2028 or 2029. Demand already outstrips supply by 30%, said analyst Handel Jones.
“All I see is demand continuing to go higher and higher,” said Kevin Chang, a TSMC senior vice president. “It is certainly going to cause a lot of constraints.” An advanced package can cost $500, versus $40 for simpler ones, pushing startups like Majestic Labs to avoid CoWoS entirely. “Didn’t want to touch it,” said Sha Rabii, the company’s president.
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Intel, a longtime packaging leader, is recruiting customers and just hired a new executive to head the unit. Applied Materials is building a $5 billion R&D hub in Silicon Valley, while Amkor Technology is investing $7 billion in an Arizona packaging plant after talks with Trump officials and interest from Nvidia and Apple. “Very strong demand, wanting to build a U.S. ecosystem,” said Amkor CEO Kevin Engel.
Yet the U.S. remains tethered to Taiwan. Former Intel CEO Patrick Gelsinger warned, “packaging is the most important thing. And our packaging supply chains may be even more precarious.” A Trump official, speaking anonymously, insisted nine packaging projects have CHIPS Act funding and more are under review.
Iyer’s scuttled center, planned for an Arizona State University research park, was announced in January 2025 but stalled until Commerce Secretary Howard Lutnick declared its overseer, Natcast, illegally formed and clawed back $7.4 billion in research funds. Gelsinger, now a venture capitalist, argued the facility should have used existing infrastructure. Iyer, who wasn’t involved in site selection, agreed but added, “I thought I put together a good program. I did not expect it to fall apart.”
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Alternative approaches are emerging. Australian startup Syenta proposes electrochemical techniques for extra-large packages with up to a twentyfold bandwidth boost, said CEO Jekaterina Viktorova. Japanese chemical maker Resonac launched a 12-company packaging consortium near Silicon Valley. By 2029, TSMC predicts a 48-fold increase in computing transistors per package compared with 2024, underscoring the stakes for U.S. competitiveness.
